Retention and exposure
If the plating layer holds diamond grits too weakly, abrasive particles can be pulled out under cutting load. If the plating covers too much of the grit, the wire may lose sharpness.
Effective electroplated wire needs a controlled balance between exposure and support.
Influence on cutting
Poor retention shortens wire life and may increase cutting force as the wire becomes dull. Uneven distribution can create local scratches or inconsistent material removal.
For brittle materials such as sapphire, SiC, and glass, abrasive condition can influence both surface roughness and subsurface damage.