Experimental themes
Chinese papers on endless electroplated diamond wire report cutting tests on polysilicon and discuss wire speed, feed rate, tension, and surface roughness.
One summarized study used wire speed around 20-40 m/s, feed around 2-10 mm/min, and tension around 60-100 N for its own test environment, with smooth silicon wafer surfaces reported.
Practical planning
For a buyer, silicon cutting data should include material type, ingot or block dimensions, target thickness, kerf, surface finish, chipping allowance, and expected throughput.
Machine rigidity, coolant cleanliness, fixture design, and wire condition are as important as the nominal wire specification.