Abrasive action
Diamond grits contact the workpiece and remove material by scratching, micro-cutting, fracture, or a combination of these mechanisms.
In brittle materials, cracks and small chips may form near the cutting path. In some materials and parameter windows, smoother removal can reduce damage.
Why tests matter
The same wire can behave differently on silicon, sapphire, SiC, marble, graphite, and metal. Hardness, fracture toughness, thermal behavior, and coolant compatibility change the process.
A process plan should therefore be material-specific rather than copied from a general cutting table.