Sawing force findings
One Chinese study on single crystal SiC reports that cutting force decreased as wire speed increased and increased as feed rate increased under its tested conditions.
It also discusses material removal per unit wire length and sawing specific energy as ways to interpret the force behavior.
Engineering meaning
For SiC, process settings must manage force, cracks, wire wear, heat, and surface damage. Small parameter changes can matter because the material is unforgiving.
A test cut should measure not only whether the material can be separated, but also crack behavior, edge quality, kerf, and downstream polishing allowance.